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ASM
Singapore · Singapore

Senior Engineer, Process Engineering (Advanced Packaging)

BU1.ALD NT KPU
Found on asm.com · last checked today

About this role

Description from ASM's career page

  Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.     Job's mission As a Senior Process Engineer in Advanced Packaging, you will bring your PhD research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies. What you will be working on Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies. Design, execute, and analyze experiment

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