HVM Field Process Engineer – PEALD, PECVD

  Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.   As a Field Process Engineer supporting PEALD Plasma-enhanced  Atomic Layer   Deposition (PEALD) and Plasma-enhanced  Chemical  Vapor  Deposition ( PECVD) on ASM’s XP8 DCM/QCM platforms, you will act as the on‑site process expert at customer HVM fabs. You will optimize deposition processes, resolve technical issues, and ensure tool performance meets customer and ASM requirements. This role is ideal for engineers who enjoy hands‑on problem‑solving, fast‑paced environments, and contributing to next‑generation semiconductor manufacturing. Key Responsibilities Lead process qualification and optimization during tool installs and ramp‑up. Execute structured DOEs to improve film quality, uniformity, and throughput. Troubleshoot process issues using sys